Nanotec 2005

Microtechnological Foundations 33

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3.1 Planar Technology 33

3.2 Preparation of Thin Layers 37

3.2.1 Condition and Preprocessing of the Substrate Surface 37

3.2.2 Layer Deposition from the Gas Phase 39

3.2.3 Evaporation 42

3.2.4 Sputtering 43

3.2.5 Chemical Vapor Deposition 46

3.2.6 Galvanic Deposition 48

3.2.7 Deposition by Spinning (Spin Coating) 50

3.2.8 Shadow-mask Deposition Techniques 53

3.3 Preparation of Ultrathin Inorganic Layers and Surface-bound Nanoparticles 54

3.3.1 Ultrathin Layers by Vacuum Deposition Processes 54

3.3.2 Deposition of Ultrathin Films from the Liquid Phase 55

3.3.3 In Situ Generation of Ultrathin Inorganic Films by Chemical Surface Modification 56

3.3.4 In Situ Formation of Ultrathin Inorganic Layers on Heteroorganic Materials 57

3.3.5 Immobilization of Nanoparticles 58

3.3.6 In Situ Formation of Inorganic Nanoparticles 59

3.4 Structure Generation and Fabrication of Lithographic Masks 59

3.4.1 Adhesive Mask Technique 59

3.4.2 Role of Resist in Photolithography 63

3.4.3 Serial Pattern Transfer 64

3.4.4 Group Transfer Processes 67

3.4.5 Maskless Structure Generation 68

3.4.6 Soft Lithography 68

3.5 Etching Processes 70

3.5.1 Etching Rate and Selectivity 70

3.5.2 Isotropic and Anisotropic Etching Processes 71

3.5.3 Lithographic Resolution in Etching Processes 72

3.5.4 Wet Etching Processes 73

3.5.5 Dry Etching Processes 76

3.5.6 High-resolution Dry Etching Techniques 78

3.5.7 Choice of Mask for Nanolithographic Etching Processes 80

3.6 Packaging 80

3.7 Biogenic and Bioanalogue Molecules in Technical Microstructures 84

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